Bangalore, Hyderabad · On-site
Interim Engineering Intern (Hardware)
InternshipPosted
- Salary
- Not disclosed
- Experience
- 0–1 yearsFreshers welcome
- Eligible batches
- 2026 · 2027
- Degree
- Bachelors, Masters
- Location
- Bangalore, HyderabadOn-site
- Apply by
- 8 Mar 2027
About the role
Qualcomm India is offering a full‑time hardware internship where you will join chip‑design and verification teams working on SOC physical design, RF/analog layout, mixed‑signal, power IC, digital ASIC, FPGA and board design.
Responsibilities
- Assist in SOC validation, debugging and verification activities.
- Contribute to RF/analog and mixed‑signal IC design tasks.
- Support low‑power, digital ASIC and FPGA design projects.
- Participate in design‑for‑test (DFT) and CPU design efforts.
- Collaborate with cross‑functional teams and document progress.
Eligibility
- Masters or Bachelors degree in Electrical Engineering, VLSI, Embedded, or ECE.
- Strong analytical and problem‑solving abilities.
- Good verbal and written communication skills.
Skills
- Verilog or VHDL for RTL design.
- C/C++ programming.
- Scripting with Tcl, Perl or shell.
- Familiarity with CAD tools such as Cadence and SpectreRF.
- Understanding of wireless/wired communication protocols is a plus.
Resume keywords
Terms from this listing. Many screening tools match exact words, so mirror the ones you genuinely have.
- Verilog
- Vhdl
- C
- C++
- Tcl
- Perl
- Shell scripting
- RTL
- Cadence
- Spectrerf
You'll apply on careers.qualcomm.com
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About Qualcomm
Qualcomm Incorporated is an American semiconductor and wireless-technology company headquartered in San Diego, California.
Founded 1985 · 5000+ employees · HQ San Diego, California, USA
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