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Intel

Bangalore · Hybrid

Silicon Package Design Engineer

Full-timePosted
Salary
₹17.6–32.3 LPAEstimated from Glassdoor data for this role at Intel. The employer has not stated pay.
Experience
1–6 years
Eligible batches
2020 – 2025
Degree
Bachelor's, Master's
Location
BangaloreHybrid

About the role

Intel is seeking a Silicon Package Design Engineer to lead the creation of advanced substrate layouts for silicon‑package‑board solutions. Based in Bangalore, you will work on EMIB technologies, perform signal‑integrity studies, and ensure designs meet electrical and manufacturing standards.

Responsibilities

  • Develop physical layout designs for silicon packages, assembly test chips, and EMIB technologies.
  • Collaborate with customers and electrical engineers to optimise signal integrity and power delivery.
  • Create bump patterns, perform routing planning and power‑grid placement while adhering to design rules.
  • Execute layout verification tasks such as DRC, connectivity checks and electromigration analysis.
  • Provide feedback on feasibility studies and implement customer enhancement requests.
  • Document design processes and maintain artefacts in PLM systems.

Eligibility

  • Bachelor's degree in Electrical, Electronics or Computer Engineering (or related STEM field) with 1‑6 years of hands‑on silicon packaging design experience.
  • Or a Master's degree in a related discipline with no prior professional experience.

Skills

  • Proficiency with EDA tools such as Cadence or Siemens for package/PCB design.
  • Familiarity with programming/scripting languages – Python, Perl, Linux shell, or SKILL.
  • Strong grasp of electrical field theory and electronic fundamentals.
  • Excellent written and verbal communication.
  • Detail‑oriented, customer‑focused and results‑driven.

Resume keywords

Terms from this listing. Many screening tools match exact words, so mirror the ones you genuinely have.

Asked for

  • Cadence
  • Siemens
  • Python
  • Perl
  • Linux
  • Skill

Nice to have

  • Communication
  • Attention to detail
  • Customer oriented
  • Motivated
  • Results driven
Tailor my resume with these

Benefits

  • Hybrid work model allowing split time between the Bangalore site and remote work.
  • Opportunity to work on cutting‑edge semiconductor packaging technologies.
  • Collaborative environment within Intel’s Assembly and Test Technology Development group.
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About Intel

Intel Corporation is an American multinational semiconductor company headquartered in Santa Clara, California that designs, manufactures, and sells microprocessors, chipsets, memory, networking, and related computing products.

Founded 1968 · 10000+ employees · HQ Santa Clara, California, United States

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Silicon Package Design Engineer

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